Metal surface treatment agent 'SSP Series' before applying the resist.
Simultaneously achieve surface cleaning and primer treatment! Reduces labor hours.
The "SSP Series" was developed for processing in the pre-lamination stage, particularly when it is physically difficult to polish inner layers or flexible substrates with machinery, and when there is a desire to minimize chemical etching. It is now possible to completely remove chromium, which was previously considered difficult with conventional processing, using a single solution. 【Features】 ■ Removes impurities without significantly etching the copper surface ■ Simultaneously removes oxides, grease, and rust inhibitors ■ Improves resolution by allowing for a smooth treatment of the copper surface ■ Provides sufficient adhesion to the resist due to the primer film ■ Offers simple rust prevention until the next process due to the primer film *For more details, please refer to the PDF document or feel free to contact us.
- Company：ヤコー
- Price：Other
